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FPC Design Guide
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FPC Design Guide

No：CRT_MINING_V01
Layer Count: 10L
Base Material： FR4 Tg170
Board Thicknes： 2.0mm
Copper Thickness： 35um
Surface Finish： ENIG（0.05-0.1um）
Single size： 196.02x227.97mm
panel size： 212.02x227.97mm
Special handicraft products:： *Impedance control
*The holes of VIP resin plugs shall be filled by electroplating
Application Segment： Auto,Industrial,Medical,Comsumer
Availability:

Product Description

TRACES /SPACES
Min Line Width / spacing (Outer Layer)3 /3.5 mil0.076 mm/0.089 mm
Min Line Width / Spacing (inner Layer)3 /3.5 mil0.076 mm/0.089 mm
Min Copper Space to outline CNCRoute/Score10/12 mil0.25 mm/0.3 mm
SOLDER MASK COLORSSILK SCREEN COLORS
Green, Matte Green, Light Green, Black,Matte Black, White, Yellow, Red, Blue, ClearWhite, Black, Yellow, Red, Blue, Green
SOLDER MASK
Min Solder Mask Print Width (Mask Dam)4 mil0.102 mm
Solder Mask Registration Tolerance±2 mil0.051 mm
CONTROLLED IMPEDANCE

Controlled lmpedance (Standard)+10%
Controlled lmpedance (Upon Request)+7%
SURFACE FINISHES
Lead Solder (HASL)OSP (Entek)
Lead Free Solder (HASL)Deep/Hard/Flash Gold (ElectrolyticNickel Gold)
Immersion Gold (Electroless Nickel Gold -ENIG)Wirebondable Gold (99.99% Pure Gold
Immersion SilverCarbon Ink
Immersion Tin (White Tin)Gold Finger (Hard Gold)
MATERIALS
FR4 (135°C Tg)Flex
FR4 (170°C-180'C Tg)Rigid-Flex
Aluminum