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  • SSD PCB
    SSD PCB
    No：CRT_SSD_V01

    Layer Count: 10-layer HDI

    Base Material： FR4 Tg170

    Board Thicknes： 0.8mm

    Copper Thickness： 35um

    Surface Finish： ENIG（≥0.05um）+Golden finger（≥0.25um）

    Single size： 22*80mm

    panel size： 132*166mm

    Special handicraft products:：*Blind hole structure

    *plated over filled vias

    *Impedance control"

    Application Segment：Auto,Industrial,Medical,Comsumer
  • SSD hard disk PCB
    SSD hard disk PCB
    No：CRT_SSD_V02

    Layer Count: 12-layer HDI

    Base Material： FR4 Tg170

    Board Thicknes： 0.8mm

    Copper Thickness： 35um

    Surface Finish： ENIG（≥0.05um）+Golden finger（≥0.25um）

    Single size： 22*80mm

    panel size： 123*80mm

    Special handicraft products:：*Blind hole structure

    *plated over filled vias

    *Impedance control

    *Fill the through-hole resin plug hole with electroplating"

    Application Segment：Auto,Industrial,Medical,Comsumer
  • Control PCB
    Control PCB
    No：CRT_IND_V01

    Layer Count: 2L

    Base Material： FR4 Tg150

    Board Thicknes： 0.9mm

    Copper Thickness： 35um

    Surface Finish： ENIG（0.05-0.1um）

    Single size： 28*30mm

    panel size： 80 x 175mm

    Special handicraft products:：*Yellow solder_ Mask

    Application Segment：Auto,Industrial,Medical,Comsumer

     
  • Aluminum Based PCB
    Aluminum Based PCB
    No： CRT_Aluminum_V01

    Layer Count: single

    Base Material： MC-Alu (AL5052) Bergquist HPL

    Board Thicknes： 1.64mm

    Copper Thickness： 35um

    Surface Finish： HASL Pb-free

    Single size： 85*85mm

    panel size： /

    Special handicraft products:： *Metal substrate

    Application Segment： Auto,Industrial,Medical,Comsumer

     
  • Video motherboard
    Video motherboard
    NO: CRT_VideoMB_PCBA_v01

    type：Multilayer PCBA

    Base Material：FR4

    PCB size：100.3mm*101.3mm

    PCB thickness：1.6mm

    Workmanship: SMT & BGA

    Application: Video motherboard
  • High-Volume Rigid-Flex PCB
    High-Volume Rigid-Flex PCB
    Routing Rules

          Traces in bend areas ≥45° to bend direction

          Orthogonal routing between adjacent layers

     
    Reinforcement Design

          0.3mm stainless steel stiffeners under connectors

          Reinforcement ribs (≥3mm width) at bend start/end points

     


    Component Placement

          No components >0402 within 5mm of bend areas

          No BGAs within 3mm of rigid-flex junctions
  • Rigid-Flex PCB Design Guide
    Rigid-Flex PCB Design Guide

    Basic Parameters

    Layer Configuration: 4 rigid layers + 2 flexible layers; total layer count range: 2 to 20 layers.

    Dimensions & Thickness:Minimum/maximum dimensions (to be specified);

    Rigid layer thickness: 0.2–3.0 mm;

    Flexible layer thickness: 50–200 μm;

    Line Width/Line Spacing: Minimum line width 50 μm; minimum line spacing 50 μm.

    Hole Diameter: Minimum drilled hole diameter 0.3 mm.



    Electrical Performance

    Impedance Control: Supports characteristic impedance of 50Ω/75Ω; differential impedance control accuracy (to be specified per project).

    Operating Temperature:

    Flexible section: -40°C to +150°C;

    Rigid section: Standard temperature resistance (industry conventional range).

    Insulation Resistance: Meets industry standards for high-reliability applications.

    Withstand Voltage: Compliant with IPC dielectric strength requirements.

    Signal Transmission Rate: Supports high-speed interfaces such as HDMI, USB 3.0, and other high-frequency signals.

  • Rigid-Flex Hybrid Circuits
    Rigid-Flex Hybrid Circuits
    Basic Parameters:

    Layer Structure:4 rigid layers + 2 flexible layers (total layers range: 2–20 layers).

    Dimensions and Thickness:Rigid layer thickness: 0.2–3.0 mm;

    Flexible layer thickness: 50–200 μm;

    Minimum line width/line spacing: 50 μm each;

    Minimum drill hole diameter: 0.3 mm.

     
    Electrical Performance:

    Impedance Control:Supports characteristic impedance of 50Ω/75Ω with controlled differential impedance accuracy.

    Operating Temperature:Flexible section: -40°C to +150°C;

    Rigid section: Standard temperature resistance (conventional range).

    Other Parameters:

    Insulation resistance, withstand voltage, and high-speed signal transmission capabilities (e.g., HDMI, USB 3.0).



    Testing Standards and Processes:


    Compliance:Follows international standards: IPC-A-600 (rigid boards), IPC-A-610 (assemblies), IPC-2223 (flexible boards).

    Internal Testing:AOI (Automated Optical Inspection);

    X-Ray interlayer alignment inspection;

    Bending fatigue test;

    Constant temperature and humidity test.
  • Industrial-Grade Rigid-Flex PCBs
    Industrial-Grade Rigid-Flex PCBs
    Basic Parameters

    Layer Configuration: 4 rigid layers + 2 flexible layers; total layer count range: 2 to 20 layers.

    Dimensions & Thickness:Minimum/maximum dimensions (to be specified);

    Rigid layer thickness: 0.2–3.0 mm;

    Flexible layer thickness: 50–200 μm;

    Line Width/Line Spacing: Minimum line width 50 μm; minimum line spacing 50 μm.

    Hole Diameter: Minimum drilled hole diameter 0.3 mm.



    Electrical Performance

    Impedance Control: Supports characteristic impedance of 50Ω/75Ω; differential impedance control accuracy (to be specified per project).

    Operating Temperature:

    Flexible section: -40°C to +150°C;

    Rigid section: Standard temperature resistance (industry conventional range).

    Insulation Resistance: Meets industry standards for high-reliability applications.

    Withstand Voltage: Compliant with IPC dielectric strength requirements.

    Signal Transmission Rate: Supports high-speed interfaces such as HDMI, USB 3.0, and other high-frequency signals.
  • Rigid-flex PCB Prototyping
    Rigid-flex PCB Prototyping
    Basic Parameters

    Layer Configuration: 4 rigid layers + 2 flexible layers; total layer count range: 2 to 20 layers.

    Dimensions & Thickness:Minimum/maximum dimensions (to be specified);

    Rigid layer thickness: 0.2–3.0 mm;

    Flexible layer thickness: 50–200 μm;

    Line Width/Line Spacing: Minimum line width 50 μm; minimum line spacing 50 μm.

    Hole Diameter: Minimum drilled hole diameter 0.3 mm.



    Electrical Performance

    Impedance Control: Supports characteristic impedance of 50Ω/75Ω; differential impedance control accuracy (to be specified per project).

    Operating Temperature:

    Flexible section: -40°C to +150°C;

    Rigid section: Standard temperature resistance (industry conventional range).

    Insulation Resistance: Meets industry standards for high-reliability applications.

    Withstand Voltage: Compliant with IPC dielectric strength requirements.

    Signal Transmission Rate: Supports high-speed interfaces such as HDMI, USB 3.0, and other high-frequency signals.
  • High-Density Interconnect (HDI) Rigid-Flex PCBS
    High-Density Interconnect (HDI) Rigid-Flex PCBS
    Basic Parameters

    Layer Configuration: 4 rigid layers + 2 flexible layers; total layer count range: 2 to 20 layers.

    Dimensions & Thickness:Minimum/maximum dimensions (to be specified);

    Rigid layer thickness: 0.2–3.0 mm;

    Flexible layer thickness: 50–200 μm;

    Line Width/Line Spacing: Minimum line width 50 μm; minimum line spacing 50 μm.

    Hole Diameter: Minimum drilled hole diameter 0.3 mm.



    Electrical Performance

    Impedance Control: Supports characteristic impedance of 50Ω/75Ω; differential impedance control accuracy (to be specified per project).

    Operating Temperature:

    Flexible section: -40°C to +150°C;

    Rigid section: Standard temperature resistance (industry conventional range).

    Insulation Resistance: Meets industry standards for high-reliability applications.

    Withstand Voltage: Compliant with IPC dielectric strength requirements.

    Signal Transmission Rate: Supports high-speed interfaces such as HDMI, USB 3.0, and other high-frequency signals.
  • Rigid-flex PCB Customization
    Rigid-flex PCB Customization
    Basic Parameters

    Layer Configuration: 4 rigid layers + 2 flexible layers; total layer count range: 2 to 20 layers.

    Dimensions & Thickness:Minimum/maximum dimensions (to be specified);

    Rigid layer thickness: 0.2–3.0 mm;

    Flexible layer thickness: 50–200 μm;

    Line Width/Line Spacing: Minimum line width 50 μm; minimum line spacing 50 μm.

    Hole Diameter: Minimum drilled hole diameter 0.3 mm.

     
    Electrical Performance

    Impedance Control: Supports characteristic impedance of 50Ω/75Ω; differential impedance control accuracy (to be specified per project).

    Operating Temperature:

    Flexible section: -40°C to +150°C;

    Rigid section: Standard temperature resistance (industry conventional range).

    Insulation Resistance: Meets industry standards for high-reliability applications.

    Withstand Voltage: Compliant with IPC dielectric strength requirements.

    Signal Transmission Rate: Supports high-speed interfaces such as HDMI, USB 3.0, and other high-frequency signals.