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Rigid-flex PCB
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Rigid-flex PCB

  • High-Volume Rigid-Flex PCB
    High-Volume Rigid-Flex PCB
    Routing Rules

          Traces in bend areas ≥45° to bend direction

          Orthogonal routing between adjacent layers

     
    Reinforcement Design

          0.3mm stainless steel stiffeners under connectors

          Reinforcement ribs (≥3mm width) at bend start/end points

     


    Component Placement

          No components >0402 within 5mm of bend areas

          No BGAs within 3mm of rigid-flex junctions
  • Rigid-flex PCB Customization
    Rigid-flex PCB Customization
    Basic Parameters

    Layer Configuration: 4 rigid layers + 2 flexible layers; total layer count range: 2 to 20 layers.

    Dimensions & Thickness:Minimum/maximum dimensions (to be specified);

    Rigid layer thickness: 0.2–3.0 mm;

    Flexible layer thickness: 50–200 μm;

    Line Width/Line Spacing: Minimum line width 50 μm; minimum line spacing 50 μm.

    Hole Diameter: Minimum drilled hole diameter 0.3 mm.

     
    Electrical Performance

    Impedance Control: Supports characteristic impedance of 50Ω/75Ω; differential impedance control accuracy (to be specified per project).

    Operating Temperature:

    Flexible section: -40°C to +150°C;

    Rigid section: Standard temperature resistance (industry conventional range).

    Insulation Resistance: Meets industry standards for high-reliability applications.

    Withstand Voltage: Compliant with IPC dielectric strength requirements.

    Signal Transmission Rate: Supports high-speed interfaces such as HDMI, USB 3.0, and other high-frequency signals.
  • Ultra-thin Rigid-flex PCB Supplier
    Ultra-thin Rigid-flex PCB Supplier
    Basic Parameters

    Layer Configuration: 4 rigid layers + 2 flexible layers; total layer count range: 2 to 20 layers.

    Dimensions & Thickness:Minimum/maximum dimensions (to be specified);

    Rigid layer thickness: 0.2–3.0 mm;

    Flexible layer thickness: 50–200 μm;

    Line Width/Line Spacing: Minimum line width 50 μm; minimum line spacing 50 μm.

    Hole Diameter: Minimum drilled hole diameter 0.3 mm.

     
    Electrical Performance

    Impedance Control: Supports characteristic impedance of 50Ω/75Ω; differential impedance control accuracy (to be specified per project).

    Operating Temperature:

    Flexible section: -40°C to +150°C;

    Rigid section: Standard temperature resistance (industry conventional range).

    Insulation Resistance: Meets industry standards for high-reliability applications.

    Withstand Voltage: Compliant with IPC dielectric strength requirements.

    Signal Transmission Rate: Supports high-speed interfaces such as HDMI, USB 3.0, and other high-frequency signals.
  • Industrial rigid flexible PCB
    Industrial rigid flexible PCB
    No： CRT_RFPCB_V01

    Layer Count: 4L(Rigid-Flex)

    Base Material： FR4 Tg150 + PI

    Board Thicknes： Rigid-0.6mm，Flex-0.18mm

    Copper Thickness： 35um

    Surface Finish： ENIG（0.05-0.1um）

    Single size： 49.5*20.6mm

    Special handicraft products:： *Gold finger design at soft board

    Application Segment： Auto,Industrial,Medical,Comsumer
  • Motor Rigid-FLEX PCB
    Motor Rigid-FLEX PCB
    No：CRT_MOTORF_V02

    Layer Count: 2L

    Base Material： FR4 Tg150 + PI

    Board Thicknes： Rigid-0.28mm，Flex-0.15mm

    Copper Thickness： 35um

    Surface Finish： ENIG（0.05-0.1um）

    Single size： 122*40.72mm

    Special handicraft products:：*Gold finger design at soft board

    Application Segment：Auto,Industrial,Medical,Comsumer



     
  • Smart home PCB
    Smart home PCB
    No：CRT_SMART_V01

    Layer Count: 2L

    Base Material： FR4 Tg150 + PI

    Board Thicknes： Rigid-0.8mm，Flex-0.2mm

    Copper Thickness： 35um

    Surface Finish： ENIG（0.05-0.1um）

    Single size： 23.6*39.8mm

    Special handicraft products:： Gold finger design at soft board

    Application Segment： Auto,Industrial,Medical,Comsumer