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Manufacturing Capacity

Manufacturing capacity parameter table
  • Material: (ROHS, Halogen Free & Reach Compliance) FR-4 (Tg130-170)
    Fiber board: ShengYi, ITEQ, KB
    Metal base: Larid, Ventec, Boyu
    Soft board: Taiflex, Shengyi
    Special materials: High Speed FR4, Ceramics & Telflon...
    Number of top floors (16+ layers)
    Multiple compaction
    Blind buried high density plate
    Thick copper: PCB up to 6oz, FPC up to 3oz
    LW/LS Minimum line spacing: 3.0mil/3.0mil (PCB), 2.0mil/2.0mil (FPC)
    Minimum Drill Tsui: 0.15mm (PCB), 0.10mm (FPC)
    Surface treatment
    Spraying Tin / OSP/Sn / Silver / Gold / Gold Finger / Selective Hard Gold Mixed Surface Treatment /(High Resistance) Carbon Oil
    Ping-head cone hole / flat hole
    Control deep milling