High-Density Interconnect (HDI) Rigid-Flex PCBS

Basic Parameters
Layer Configuration: 4 rigid layers + 2 flexible layers; total layer count range: 2 to 20 layers.
Dimensions & Thickness:Minimum/maximum dimensions (to be specified);
Rigid layer thickness: 0.2–3.0 mm;
Flexible layer thickness: 50–200 μm;
Line Width/Line Spacing: Minimum line width 50 μm; minimum line spacing 50 μm.
Hole Diameter: Minimum drilled hole diameter 0.3 mm.

Electrical Performance
Impedance Control: Supports characteristic impedance of 50Ω/75Ω; differential impedance control accuracy (to be specified per project).
Operating Temperature:
Flexible section: -40°C to +150°C;
Rigid section: Standard temperature resistance (industry conventional range).
Insulation Resistance: Meets industry standards for high-reliability applications.
Withstand Voltage: Compliant with IPC dielectric strength requirements.
Signal Transmission Rate: Supports high-speed interfaces such as HDMI, USB 3.0, and other high-frequency signals.