High-Volume Rigid-Flex PCB

Routing Rules
Traces in bend areas ≥45° to bend direction
Orthogonal routing between adjacent layers

Reinforcement Design
0.3mm stainless steel stiffeners under connectors
Reinforcement ribs (≥3mm width) at bend start/end points

Component Placement
No components >0402 within 5mm of bend areas
No BGAs within 3mm of rigid-flex junctions

Product Description

Basic Structural Parameters
Parameter Category	Technical Specifications	Design Guidelines
Rigid-Flex Zoning	Rigid area: ≥3 layers Flexible area: 1-2 layers	Transition zone: ≥5mm gradient design (impedance/thickness tapering)
Bend Radius	Static bend: ≥10×board thickness	No through-holes allowed in bend areas (≥2mm from bend line)
	Dynamic bend: ≥20×board thickness
Material Stackup	Rigid: FR-4 Tg170℃	CTE difference ≤5ppm/℃ between rigid/flex materials
	Flex: Polyimide (PI) 12.5-50μm
Total Thickness	Rigid zone: 0.8-3.2mm	Thickness transition steps ≤0.2mm at junctions
	Flex zone: 0.1-0.3mm

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