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Rigid-Flex Hybrid Circuits
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Rigid-Flex Hybrid Circuits

Basic Parameters:
Layer Structure:4 rigid layers + 2 flexible layers (total layers range: 2–20 layers).
Dimensions and Thickness:Rigid layer thickness: 0.2–3.0 mm;
Flexible layer thickness: 50–200 μm;
Minimum line width/line spacing: 50 μm each;
Minimum drill hole diameter: 0.3 mm.
 
Electrical Performance:
Impedance Control:Supports characteristic impedance of 50Ω/75Ω with controlled differential impedance accuracy.
Operating Temperature:Flexible section: -40°C to +150°C;
Rigid section: Standard temperature resistance (conventional range).
Other Parameters:
Insulation resistance, withstand voltage, and high-speed signal transmission capabilities (e.g., HDMI, USB 3.0).

Testing Standards and Processes:
Compliance:Follows international standards: IPC-A-600 (rigid boards), IPC-A-610 (assemblies), IPC-2223 (flexible boards).
Internal Testing:AOI (Automated Optical Inspection);
X-Ray interlayer alignment inspection;
Bending fatigue test;
Constant temperature and humidity test.
Availability:

Product Description

PCB Manufacturing capabilities
Rigid, Flex, Rigid-Flex, Metal Core, HDl, High-Frequency, High-TG
Max Number of PCB LayersUp to 48 Layers
Min Trace/Space3 mil (0.0762mm)
Min Mechanical Drill Size8mil (0.20mm)
Min Laser Drill Size3 mil (0.0762mm)
Max Inner/Outer Copper50z/ 11 0z
 MaterialFR4, FR4 High Tg, Aluminum, Rogers, Arlon, etc.
Surface

Lead Solder (HASL), Lead Free Solder(HASL-LF), ENIG.

Immersion Silver, lmmersion Tin, OSP, Hard Gold, Flash Gold, etc.

Blind / Buried Vas
Controlled lmpedance +/-7%