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Rigid-Flex PCB Manufacturer
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Rigid-Flex PCB Manufacturer

Basic Parameters
Layer Configuration: 4 rigid layers + 2 flexible layers; total layer count range: 2 to 20 layers.
Dimensions & Thickness:Minimum/maximum dimensions (to be specified);
Rigid layer thickness: 0.2–3.0 mm;
Flexible layer thickness: 50–200 μm;
Line Width/Line Spacing: Minimum line width 50 μm; minimum line spacing 50 μm.
Hole Diameter: Minimum drilled hole diameter 0.3 mm.

Electrical Performance
Impedance Control: Supports characteristic impedance of 50Ω/75Ω; differential impedance control accuracy (to be specified per project).
Operating Temperature:
Flexible section: -40°C to +150°C;
Rigid section: Standard temperature resistance (industry conventional range).
Insulation Resistance: Meets industry standards for high-reliability applications.
Withstand Voltage: Compliant with IPC dielectric strength requirements.
Signal Transmission Rate: Supports high-speed interfaces such as HDMI, USB 3.0, and other high-frequency signals.
Availability:

Product Description

   Parameter                                                    Range      Units
Materials usedFR-4 (High Tg), PTFE, Polyimide
Solder Resist (Liquid Photo-Imageable)Solder Resist (Liquid Photo-Imageable)
Legend (ink)Colors: white (standard),yellow
Multi-Layered1-12 or moreNOS.
PCB Thickness0.008 to 0.126inch
Surface FinishHASL (Leaded and Lead-Free) immersion silver (0.2 microns) immersion Gold (0.l micron) over Electroless Nickel(5 microns)
Track width / spacingoz copper: minimum 0.004/0.004 1 oz copper: minimum 0.006/0.006 2 oz copper: minimum 0.008/0.008 3 ozcopper: minimum 0.012/0.012inch